Hot Press Black Aln Aluminum Nitride

Product Details
Customization: Available
Application: Refractory, Structure Ceramic, Industrial Ceramic
Type: Ceramic Plates
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Number of Employees
89
Year of Establishment
2014-08-13
  • Hot Press Black Aln Aluminum Nitride
  • Hot Press Black Aln Aluminum Nitride
  • Hot Press Black Aln Aluminum Nitride
  • Hot Press Black Aln Aluminum Nitride
  • Hot Press Black Aln Aluminum Nitride
  • Hot Press Black Aln Aluminum Nitride
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  • Overview
  • Company Profile
  • Product Description
  • Typical Application
  • Packaging & Shipping
Overview

Basic Info.

Name
Hot Pressing Black Aln Aluminum Nitride
Density
3.3G/Cm3
Thermal Conductivity
>180W/M*K
Purity
99.7% Aluminum Nitride Aln
Technology
Hot Pressing Aln Aluminum Nitride
Keyword
HP Aln Aluminum Nitride
Flexural Strength
350MPa
Elastic Modulus
320gpa
Harness
890hl
Thermal Expansion Coefficient
4.4
Dielectric Constant
9
Usage
Thermal Conductivity
Max. Size
Od380*H50mm
Export Experience
Semiconductor Aln Ceramic Parts
Advantage
Semiconductor Aluminum Nitride Ceramic Parts
Material
Aln Aluminum Nitride
Transport Package
Air Freight Safety Packing
Specification
365*345*50mm
Trademark
PENSC aln aluminum nitride
Origin
China
HS Code
6914900000
Production Capacity
320000PCS Per Day

Product Description

Hot Press Black Aln Aluminum Nitride

 

Company Profile

Shandong Pengcheng Advanced Ceramics Co.,Ltd is set up since year of 1997, focus on ALN ALUMINUM NITRIDE Ceramic materials research & production.

 
HP AlN Ceramics, purity 99.5%, thermal conductivity has 140w/(m*k)to 210w/(m*k).
aluminum nitride ceramic heater hot pressed black color 

 
Possessed 44 sets of vacuum furnaces and matched processing, testing equipments, ranking first of China in the output,quality and sales volume.
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Product Description

 

Hot Press Black Aln Aluminum Nitride
Hot pressing ALN Aluminum nitride ceramic

- High purity
- Electrical insulator
- High thermal conductivity
- Critical thermal management material
- Reduced Particulate Generation
- Corrosion/Erosion Resistance
- Controlled Electrical Properties
Warpage Density Melting point RT Resistivity Dielectric
Constant
Dielectric Loss Dielectric Breakdown Voltage Bending strength Young's Modulus

<2.5‰

3.3g/cm3

2053ºC

1014Ω·cm

8.8(1MHz)

5(1MHz)

>15kv/mm

380MPa

340Gpa
Coefficient of heat expansion Specific Heat at RT Thermal Expansion Thermal Conductivity Shape        

4.6(10-6/k)

740J/(kg.K)

5(10-6/K)

140-210w/m*k

Customized
       
 
Typical Application

 

- Cover plates and MRI equipment(Magnetic Resonance Imaging)
- High-power detectors, plasma generators, military radios
- Electrostatic chucks and heating plates for semiconductors and integrated circuits
Infrared and microwave window material
Hot Press Black Aln Aluminum Nitride


 

Packaging & Shipping

 

Hot Press Black Aln Aluminum Nitride
Hot Press Black Aln Aluminum Nitride
 
Kevin Wang is the guy willing to achieve mutually beneficial cooperation with your

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