Chucks Aluminum Nitride Ceramic Aln Material

• Customization: Available
• Application: Refractory, Structure Ceramic, Industrial Ceramic
• Type: Ceramic Plates
• Model NO.: aluminum nitride ceramic aln material
• Name: Aluminum Nitride Ceramic Aln Material
• Density: 3.3G/Cm3
• Thermal Conductivity: >180W/M*K
• Purity: 99.7% Aluminum Nitride Aln
• Technology: Hot Pressing Aln Aluminum Nitride
• Keyword: HP Aln Aluminum Nitride
• Flexural Strength: 350MPa
• Elastic Modulus: 320gpa
• Harness: 890hl
• Thermal Expansion Coefficient: 4.4
• Dielectric Constant: 9
• Usage: Thermal Conductivity
• Max. Size: Od380*H50mm
• Export Experience: Semiconductor Aln Ceramic Parts
• Advantage: Semiconductor Aluminum Nitride Ceramic Parts
• Material: Aln Aluminum Nitride
• Transport Package: Air Freight Safety Packing
• Specification: 365*345*50mm
• Trademark: PENSC aln aluminum nitride
• Origin: China
• HS Code: 6914900000
• Production Capacity: 320000PCS Per Day

Product Description

 

Company Profile

Shandong Pengcheng Advanced Ceramics Co.,Ltd is set up since year of 1997, focus on ALN ALUMINUM NITRIDE Ceramic materials research & production.

 

HP AlN Ceramics, purity 99.5%, thermal conductivity has 140w/(m*k)to 210w/(m*k).
 

Possessed 44 sets of vacuum furnaces and matched processing, testing equipments, ranking first of China in the output,quality and sales volume.
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Chucks aluminum nitride ceramic aln material

Product Description

 

Hot pressing ALN Aluminum nitride ceramic

- High purity
- Electrical insulator
- High thermal conductivity
- Critical thermal management material
- Reduced Particulate Generation
- Corrosion/Erosion Resistance
- Controlled Electrical Properties

Warpage	Density	Melting point	RT Resistivity	Dielectric Constant	Dielectric Loss	Dielectric Breakdown Voltage	Bending strength	Young's Modulus
<2.5‰	3.3g/cm^3	2053ºC	10^14Ω·cm	8.8(1MHz)	5(1MHz)	>15kv/mm	380MPa	340Gpa
Coefficient of heat expansion	Specific Heat at RT	Thermal Expansion	Thermal Conductivity	Shape
4.6(10^-6/k)	740J/(kg.K)	5(10^-6/K)	140-210w/m*k	Customized

 

Typical Application

 

- Cover plates and MRI equipment(Magnetic Resonance Imaging)
- High-power detectors, plasma generators, military radios
- Electrostatic chucks and heating plates for semiconductors and integrated circuits
- Infrared and microwave window material

 

Packaging & Shipping

 

 

Kevin Wang is the guy willing to achieve mutually beneficial cooperation with your